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Our Capabilities
Our technology is state of the art. This page shows our routine capabilities. We love challenges and frequently do which are beyond the capabilities show here. Call our technical advisors to discuss any capabilities not shown here.
| MULTILAYER LAMINATION |
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- Maximum Board Size: 19" X 27"
- Maximum number of layers: 32
- Panel Thickness tolerance
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Panel Thickness
.015"- .030"
>.031 |
Tolerance
+/- 10%
+/- 10%
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| MATERIALS |
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- Laminate with the following parameters:
- Material types used: FR-4, Polyamid, G-Tek, Teflon, G- 10
- Inner layer copper cladding
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Maximum cu
weights (planes) 3oz
Maximum cu
weight (signals) 3oz
Minimum cu
weight 1/2oz |
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| ETCHING |
- Cupric Chloride Etching
- Ammonia Etching
- Minimum conductor width: .002"
- Minimum feature spacing: .003"
- Finished conductor widths from the original artwork
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CU weight Internal External
1oz and below +.001" +.001"
2oz +/- .002 +/- .002 |
DRILLING |
- Buried & Blind Vias
- Minimum drilled holes size: .008" (finished .004")
- Minimum slot width size: .029 (finished .025")
- Minimum hole size tolerances
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Hole Size Unplated Plated
< .040" +/- .001" +/- .002"
.040"- .093" +/- .015" +/- .004"
- Minimum distance, edge to edge, from plated hole to internal circuitry or plane: .010"
- Minimum distance, edge to edge, from non-plated hole to circuitry: .010 internal/ .007" external
- Standard finished minimum annular ring if not specified otherwise: .001
- Desired Minimum pad size is .014 over hole dia
- Tighter annular ring is possible with teardrops or by reducing finished annular ring requirements
- Controlled depth drill available
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PLATING |
- Maximum Hole Aspect Ratio: 12:1
- (SMOBC) Solder mask over bare copper, HASL/Immersion Tin
- SMOBC with OSP, ENTEK Coating 56A
- Immersion Silver
- Palladium Plating
- Immersion Gold, Selective or complete board
- Electroless Gold, Selective or complete board
- Electrolytic Gold, Selective or complete board
- Soft Bondable Gold, Selective or complete board
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LAYER CONSTRUCTIONS/ IMPEDANCE DESIGN |
- Minimum core thickness: .004"
- Minimum dielectric: .0035" (2113)
- Impedance stack-up design and verification service
- Buried and blind vias
- Sequential lamination structure
- Differential Impedance
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FABRICATION |
- Tolerance on overall dimensions: +/- .005
- Minimum inside radius: .015
- Scoring, In-Board Beveling, Beveling
- Countersinking, Counter-boring, Edge Milling
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SOLDERMASK/ LEGEND |
- Per IPC-SM-840
- Wet types: SR 1000, SR 1020, SR 2030
- LPI
- Dry Film Types: Dupont RISTON MM, SHIPLEY 5050
- Soldermask colors: Red, Green, Blue, Black, Clear
- Minimum clearance: LPI- .002", Dry Film -.003", Wet Mask - .006"
- Legend colors: White, Yellow, Black, Red, Orange
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ELECTRICAL TEST |
- CAD net-list testing
- Electrical test parameters compliant with IPC and Bellcore specifications
- Probe testing down to .006"
- Standard test parameters: isolation- 10 meg ohms, continuity- 10 ohms
- Voltage up to 250 Volts
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IMPEDANCE MEASUREMENTS |
- Printouts of Impedance measurements
- Impedance measurements of specific traces
- Single ended and differential impedances
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LABORATORY |
- Standard and thermal stress cross-section evaluation
- Layer construction verification
- Fully equipped chemical analysis lab
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DELIVERY |
- Quick Turn Delivery is as fast as 48 hours
- Standard Delivery
- Turn time is based on business days counted in 24 hour cycles
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Terms and Conditions |
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1. We offer Net 30 on approved Credit Application.
2. We accept Visa and Master Card. We don't process your credit card, unless we start your job.
3. Quotation is based on the specifications provided. Changes require a new quotation. We reserve the right to re-quote after an Engineering review of the files provided. |
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